SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

Advances in materials science stemming from research in South Korea are leading to higher-performance piezoelectric and ...

Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...

Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs, and packaging technology with a baker’s dozen ...