Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

Steve Woo, distinguished inventor and fellow at Rambus, examines the benefits of a common substrate for communication, the ...

The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

A new technical paper titled “SRAM and Mixed-Signal Logic With Noise Immunity in 3nm Nano-Sheet Technology” was published by ...

Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

A new technical paper titled “Computational Assessment of I–V Curves and Tunability of 2D Semiconductor van der Waals ...

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexible substrates, and the uncertainties ...

The path to fully autonomous vehicles may be clear in concept, but fully realizing that development environment is another ...