Semiconductor Engineering

New RDL-First PoP Fan-Out Wafer-Level Package Process With Chip-to-Wafer Bonding Technology

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
Nasdaq

Akoustis Locks Process Flow for First Wafer-Level-Chip-Scale Package (WLCSP) for XBAW Filters

Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
EDN

Will fan-out wafer-level packaging keep Moore’s Law valid?

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...
Semiconductor Engineering

Need For KGD Drives Singulated Die Screening

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...