WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

With the aim of unlocking the full potential of AI-powered vehicles, NXP Semiconductors has unveiled the S32N7 super-integration processor series for the intelligent vehicle core, designed to enable ...

The software-defined vehicle is no longer a future concept. Digital cockpits, over-the-air updates, and software-driven feature roadmaps are already shaping today’s vehicles. Yet, as automakers ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

Stellantis and dSPACE have announced a partnership aimed at enhancing the cloud-based development of vehicles, as outlined in a non-binding Memorandum of Understanding (MOU). This collaboration will ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...