Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...

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