Electronic Design

Leadless MOSFET Power Package Achieves Near-GaN Switching Losses

Modern semiconductors facilitate faster switching speeds and lower losses to support designers. A new leadless power package drives down on-state resistance and provides close to “GaN-like” switching ...
EDN

Package shrinks switch footprint

Beverly, Mass. – Clare Inc.'s line card access switch family is now available in micro lead frame packages (MLPs). The monolithic-IC replacements for 2 Form C electromechanical relays were previously ...
Electronic Design

Four-Pin TO Type MOSFET Package Lowers Switching Losses

For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
Business Wire

Toshiba Releases 3rd Generation SiC MOSFETs for Industrial Equipment with Four-Pin Package that Reduces Switching Loss

Toshiba Electronic Devices & Storage Corporation, a leading supplier of advanced semiconductor and storage solutions, draws on over half a century of experience and innovation to offer customers and ...