KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
The Global Electronics Association has published a new international standard, IPC‑6921, establishing formal requirements and acceptance criteria for organic integrated circuit (IC) substrates used in ...
Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...
A San Francisco startup has raised more than $100 million for technology that could upend the global semiconductor industry—if it proves out. Founded by a protégé of investor Peter Thiel, Substrate ...
The growth of large area graphene films with a precisely controlled numbers of layers and stacking orders can open new possibilities in electronics and photonics but remains a challenge. This study ...
Traditionally employed to make light-emitting diodes (LEDs), sapphire substrates now are being used by Apple Inc. and other smartphone makers as covers for camera lenses and home buttons, contributing ...
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