EDN

Package twist stacks dice against SoCs

SAN MATEO, Calif. — Stacked-die packaging — in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated — has taken root in the cell-phone handset market as ...
EDN

Samsung stacks DRAM dice using ‘through silicon vias’

MUNICH, Germany — Samsung Electronics has expanded it's 'through silicon via' (TSV) technique to DRAM devices. The technique, introduced a year ago for NAND chips, allows the production of smaller and ...
Benzinga.com

Stacks Price Prediction as STX Token Slides Under $2 – How Low Will STX Go?

As Bitcoin (BTC) corrects to its lowest levels in over two months below $60,000, its largest layer-2 scaling blockchain Stacks (STX) is also in decline, with the Stacks price hitting its lowest levels ...