Customers can now access more capabilities and capacity for expanded production methods, simplifying custom mechanical sourcing. SAN FRANCISCO, Jan. 17, 2024 /PRNewswire/ -- Fictiv, a global ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Predominantly, if the metal part used in compression molding is tension or compression loaded, a ratio of metal part thickness to its extensional modulus, multiplied by the Bulk Molding Compound (BMC) ...

If all goes as forecast, this summer processor Owens-Illinois will begin commercial processing of compression molded PET preforms. The Toledo, OH company says it has taken shipment of a compression ...

When engineers at General Dynamics Armament and Technical Products (GDATP) recently designed the ammunition container for a new aircraft weapon system, they decided very early in the process to make ...

The hybrid-composite rear load floor uses unidirectional (UD) thermoplastic tapes plus direct-long-fiber thermoplastic (D-LFT) composites. Thermoplastic tapes provided high stiffness/strength in a ...