Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs,

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip manufactured at a U.S. foundry, achieving the highest density of 3D chip wiring to date and delivering speed improvements of an order of magnitude.

The chip industry in China is hustling to overcome a Western tech choke hold, even as President Trump appears poised to loosen U.S. chip restrictions.