We're all familiar with two dimensional design drawings — not to mention the questions that usually accompany them because they can provide only so much information before becoming hopelessly ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Bentley Systems has released Bentley Substation V8i, an intra-operable software product for intelligent electrical and physical substation design. Bentley Systems has released Bentley Substation V8i, ...

TORONTO--(BUSINESS WIRE)--Augmenta, the company automating building design for the construction industry, today announced the Electrical Design Module, the first Generative Design solution for its ...